What are the ways of heat dissipation for electronic products? Analysis of heat dissipation methods for components

The performance of electronic products is becoming more and more powerful, while the integration and assembly density are continuously improving, which leads to a sharp increase in power consumption and heat generation. According to statistics, the material failure of electronic components caused by heat concentration accounts for 65%-80% of the total failure efficiency. Heat management technology is the key factor to be considered for electronic products. Therefore, it is necessary to strengthen the thermal control of electronic components. In order to help you have a better understanding, this article will summarize the relevant knowledge of the cooling methods of electronic components. If you are interested in what this article will cover, read on.

The efficient heat dissipation of electronic components is affected by the principles of heat transfer and hydrodynamics. The heat dissipation of electrical devices is to control the operating temperature of electronic equipment, so as to ensure its working temperature and safety. It mainly involves different aspects of heat dissipation, materials and so on. At present, the heat dissipation of electronic components mainly includes natural, forced, liquid, refrigeration, dredging, thermal isolation, etc.

Natural heat dissipation or cooling mode means that under natural conditions, it does not accept the influence of any external auxiliary energy, and uses local heating devices to control the temperature in the way of heat dissipation in the surrounding environment. Its main modes are heat conduction, convection and radiation concentration, and its main applications are convection and natural convection.


Natural heat dissipation or cooling mode is mainly used in electronic components with low temperature control requirements, low-power equipment and components with relatively low heat flux density. In sealed and densely assembled devices, this method can also be applied if no other cooling technology is required.


In some cases, when the requirements for heat dissipation capacity are relatively low, the characteristics of electronic devices can also be used to appropriately increase the heat conduction or radiation effects with adjacent heat sinks, and optimize the natural convection by optimizing the structure, so as to enhance the heat dissipation capacity of the system.
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